3．Sputtering target

Sputtering is one of the most common and widely used technologies for thin film manufacturing. We provides a variety of SPUTTERING TARGET in a variety of compositions -PVD- in a different of shapes and thickness per your specifications with purities up to 99.999 %.
Detailed Product Description
Ceramic (Alumina, Zirconia, Silicon Nitride, Alumina Nitride,MgO,ZnO,ZAO Boride, Carbide, Fluoride, Selenide, Silicide, Sulfides, Tellurides)Sputteirng Target
There are many engineers working this field over 20 years in Shanghai Kessen Ceramics Co.,ltd.
Quality is of paramount importance as we match the material to the client's needs and ensure its complete traceability.
we pride ourselves on prompt responses steady quality and competitive pricing.
Speciafication:
Purity:99%-99.9999%
Shape: Plate, Sheet, Disk, Rectangle, Tube, Rod and by drawing
Application: Optical thin film, Electric Thin film, Superconducting thin film, Protective film, Surface engineer,...
Molding Method: Vacuum hot-press, HIP furnace, HP furnace, CIP, Vacuum Sinter, Spraying
Machine: Vacuum Casting, Atmospheric Casting, Rolling(hot/cold), Cold Rolling, Forging (hot/cold), Cutting, Milling, Sawing, Grinding, etc.
Dimension: Diameter (<500mm), Length (<1000mm), Width (<500mm), Thickness (>1mm), by drawing